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Toshiba Memory America Points to the Future of Technology Fueled by BiCS FLASH 3D Flash Memory at CES 2019
LAS VEGAS--( BUSINESS WIRE )--This week at CES ® 2019 , Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, will be on hand to highlight its BiCS FLASH™ 3D technology – and the role it plays in the company’s latest flash memory, UFS, solid state drive (SSD), and KumoScale™ software products. TMA will also leverage CES as a stage to debut the fourth generation of its single-package ball grid array (BGA) SSD product line: the BG4 series Making its...